As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, Compute, 5G Broadband, Automotive, IoT and consumer electronics markets.
Gathers, integrates, and interprets information across cross functional teams from a variety of sources in order to troubleshoot issues and find solutions.
Applies deep and broad knowledge to anticipate and identify gaps/risks in processes, efforts, technical aspects of HW/System aspects etc., and closes the gaps with wide range of eco-system partners within Qualcomm and enable customer product commercialization
Individual will be responsible and acts as a tech lead on projects and owns the outcome of the project for supporting Qualcomm's growing portfolio of platforms/applications. Job involves working closely with internal partners in definition of product (as appropriate), collaborate with HW/SW/validation/test and product teams on customized use cases of customer applications, support customers on HW design signoffs, system/SoC debug, deliverables etc and effectively managing cross functional team of engineers.
Individual will be responsible to create chipset documentation, assist customers in technical responses to customer queries and troubleshooting of customer designs from overall system and SoC point of view. Candidate should have minimum 8+ Years of relevant experience.
Past expertise and experience in interacting with multiple teams in HW, SW, domain skills in Digital/High Speed/SoC, Power Management, Silicon validation, Customer engagement, ability to adapt dynamic changes to meet tight deadlines/commitments and deliver customer requirements, Strong written and oral communication skills is highly desirable.
Travelling to customer sites across geographical locations in Asia/NA etc on need basis
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Embedded systems HW/SW design preferably ARM based, board bring up, Silicon bench tests/ Characterization, measurements AC/DC parameters, SOC interface parametric measurements, basic SW integrated functional tests, Silicon validation, HW PCB design, High speed peripheral expertise, Signal Integrity and Power Integrity, System level architecture
Programming languages: ‘C’ and scripting languages PERL/PYTHON preferred. Good trouble-shooting skills with analysis and debug ability at PCB, HW IP, SW and SoC level. Expertise in High Speed Digital interfaces such as: Memory Bus I/F (UFS, eMMC, LPDDRx), USB, MIPI CSI/DSI, PCIe, SERDES etc and Power management areas like LDO, SMPS, Clock, Crystal etc. Hands on experience in working with Oscilloscopes, Logic Analyzers. Basic knowledge of ARM processors, Multi core architecture, experience in working with JTAG emulators. Knowledge of Multi-core system/inter-chip system design is a plus.
Experience in technical leadership and people management, guiding cross-functional engineering teams. Proven track record in leading projects to successful completion while supporting team growth and development.
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
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