via Career pages·3w ago

Data Converters Mixed Signal Lead, Sr. Staff

Qualcomm

Full-timeOn-site

Location:Bengaluru, IndiaType:Full-timePosted:3w ago

Job Description

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

Senior Staff – MSIP Design (RFA Connectivity IP) – Bangalore

About the Team

Qualcomm’s RFA Connectivity team is a global organization responsible for delivering high-performance, power-efficient, and cost-optimized Connectivity IP solutions—including PMU, Transceivers, and MSIP—for Mobile, Compute, AR/VR, Automotive, and IoT products.

Our portfolio spans key connectivity technologies such as Wi-Fi, Bluetooth, GNSS, and UWB, driving innovation across a wide range of devices and use cases.

Role Overview

We are seeking a Senior Engineer (10+ years of experience) to join the MSIP Bangalore Design Team. This team works closely with RF Transceiver teams to develop cutting-edge IPs for Cellular and Connectivity systems, as well as high-performance RF front-end components across advanced process nodes.