Qualcomm is the industry leader in 3G, 4G and 5G communication technology and designs the most advanced radio technology in the commercial wireless marketplace, from 5G/6G to Bluetooth.
QCT's RF Electro-Magnetic (EM) Design Team is actively seeking engineers with demonstrated experience in the design, EM simulation, and circuit modeling of RF passive components for use in our RFIC designs. Exposure to RF package, module, and PCB design and modeling is a plus.
Knowledge of PCB level Power Distribution Network (PDN) and RF transmission line layout and analysis is an asset.
Working experience and knowledge of Power Amplifier (PA) and Low Noise Amplifier (LNA) matching is an advantage.
Basic understanding of patch antenna design parameters and matching is also desired.
Responsibilities:
Design and develop RF passive components for use in the next generation of highly integrated RF integrated circuits in deep sub-micron 28nm/14nm/6nm/2nm CMOS and SOI technologies.
Work with the circuit design team to optimize component sizes and performance for use in on-chip RF circuit blocks.
Deliver components that include compact models, and DRC clean physical designs.
Execute isolation analysis and optimization to reduce on-chip and chip to package coupling.
Optimization of multichip carriers for RF systems, focusing on loss and isolation.
Participate in RF package, module, and PCB modeling to optimize overall system performance
Skills and Experience:
Experience in the design and simulation of RF passive components such as inductors, transformers, MOM/MIM capacitors and passive filters.
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Demonstrated abilities with EM simulation techniques and tool including MoM EM solvers and HFSS.
Experience with circuit design and layout using Cadence tools and Agilent ADS.
Compact RLCK Model extraction of multiport passive components.
Ability to use EM tools to predict circuit level electric and magnetic coupling.
Understanding of Chip fabrication process and design understanding
Electromagnetic theory, microwave theory and design
Antenna design and understanding of radiation and propagation wave
Good understanding of SI and PI at chip, package, and PCB level
Basic RF system understanding
Understanding of noise propagation mechanism in chip, package, and PCB
Tools: Ansys Suit (HFSS, Q3D, SiWave, Layout), Lorentz, Helic, EMX, Cadence virtuoso, Allegro or similar for Package/Module layout, Expedition (or similar) for PCB layout and schematic, VRF
Passionate self-starter and team player with experience in project leadership and multi-tasking.
Keywords:
On-chip passive, Inductor, Transformer, MOM/MIM Capacitor, Antenna, Signal and Power Integrity, PDN, Substrate coupling, RF Module, RF Package modeling, HFSS, Ansys, ADS, VRF
Educational Requirements:
Required: Bachelor’s degree in science, Engineering, or related field. Preferred: Master's and PhD
Minimum Qualifications:
Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field.
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