Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 27,000+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the Technology Powerhouse of Bosch in India with a global footprint and presence in the US, Europe and the Asia Pacific region.
Key Responsibilities:
Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production
Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes.
Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency.
Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails.
Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions.
Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews.
Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization.
Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC).
Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis.
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Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains.
Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes).
Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence). • Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance).
Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing.
Understanding of thermal design, power sequencing, and power distribution.
Experience in camera/radar interface and sensor fusion hardware design.
