PCB Design Engineer, ALG, Amazon Leo Government

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

The mission of Amazon Leo Government (ALG) team is to leverage existing Kuiper technology and provide high speed, low latency, and secure satellite broadband services to the United States and our allied government customers.

The PCB Design Engineer will play a pivotal role in the team delivering innovative and fast-paced analysis and design solutions, focusing on satellite and ground system design and analysis as well as on the design of the various communication and control needs (compute, storage, data transfer, etc.) of the electronics sub-systems. They will be expected to lead a variety of tasks, from schematic review and component selection, PCB layout, to layout review and board bring-up and test. They will work across teams and support fellow engineers with design reviews and the preparation of joint reports and proposals. The candidate will have a sharp focus on the specific needs of the customer and be able to conduct trades and analyses to show that proposed solutions will meet the customer’s goals.

The successful candidate will have demonstrated experience working on complex programs with a diverse set of talented individuals, as well as with partner organizations (including government agencies). The candidate will exhibit the potential to lead small sub-teams of electrical engineers, and be able to prepare easy-to-read and technically compelling written reports.

Key job responsibilities Interact directly with customers to understand technical requirements, and translate them into technically robust solutions backed by data and analysis. Proficiency in industry-standard EDA tools (e.g., Altium Designer, Cadence Allegro, Mentor PADS/Xpedition, KiCad, or OrCAD). Strong understanding of PCB manufacturing processes, materials, and stack-up design. Experience with multi-layer board design (16+ layers). Knowledge of high-speed digital design principles (DDR, PCIe, USB, Ethernet). Familiarity with IPC standards (IPC-2221, IPC-2222, IPC-7351). Ability to read and interpret electrical schematics. Strong attention to detail and organizational skills. Collaborate with electrical engineers, mechanical engineers, and firmware teams to translate circuit schematics into optimized board layouts. Apply design-for-manufacturing (DFM) and design-for-test (DFT) principles to ensure producibility and testability. Perform component placement, signal routing, power distribution, and thermal management optimization. Manage design constraints including impedance control, high-speed signal integrity, EMI/EMC compliance, and power integrity. Generate fabrication and assembly documentation including Gerber files, drill files, bill of materials (BOM), and assembly drawings. Conduct design rule checks (DRC) and electrical rule checks (ERC) to verify design integrity. Participate in design reviews and provide recommendations for layout improvements. Deliver well-written documentation, reports, and presentations for technical design reviews and as part of proposal efforts. Design and support test campaigns, both development and qualification/acceptance, for space hardware.