Principal Product Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.

As Microsoft's cloud business continues to grow, the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon, Manufacturing, and Packaging Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. Our key initiatives are Azure and Azure Cobalt. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Principal Product Engineer to join the team.

Responsibilities

The position will have responsibility for product/test engineering for new product development and manufacturing.

• The position requires someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.

• Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams.