Package Design Staff to Senior Staff Engineer

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, andcarrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For thoselooking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, andcarrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance driven systems. Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next generation connectivity and computeproducts. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced ICpackages that support high speed interfaces. This work directly shapes product performance, reliability, and time to market, making it a key contributor toMarvell’s overall technology leadership.

What You Can Expect

• Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advancedmicroelectronic packages.

• The engineer will be responsible for driving microelectronic package development from concept through tapeout, working with package architectsand technical leads to select appropriate technologies and ensure manufacturability, performance, reliability, and cost compliance.