Mechanical Engineering Technical Leader || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp - 12+ years

Meet the Team :

We are part of the Hardware Platform Group, with our team specializing in FPGA development. Our work spans both sophisticated data-path and challenging control-path FPGAs. The design process includes crafting the FPGA functional specification document, RTL coding, image generation and validation. We leverage industry-standard tools for FPGA design, incorporating various quality metrics to ensure a robust process. Our ultimate goal is to deliver bug-free RTL for first-pass success on the board. Additionally, we collaborate closely with our remote teams based in US and Italy.

Your Impact :

• Design and development of next generation Telecom & Datacentre products
• Participate in the architecture definition, implementation and verification phases.
• Work closely with ASIC team during initial characterisation and define system level integration based on acquired input.

• Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
• Work with multi-functional teams (hardware, software, diagnostics and signal integrity groups).
• Assist in complex subsystem level lab bring-up, integration, and unit test validation.
• Mentor team and formulate processes that allow team to grow and upskill.

• Have strong documentation and data management skills to ensure lessons learnt and accessible to the wider team

• Hands-on examples of using Ai tools for automation and faster data retrieval

Minimum Qualifications :

*Educational Background: Requires 12+aa years of hands-on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering

• Experienced in solid modelling Tools such as Creo and UG-NX
• Hands on experience with Structural Simulation tools like Ansys