Interim Engineering Intern_2027_HW

Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

We know our employees’ ideas change the world. For more than three decades, we’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue to accelerate innovation and unlock new possibilities in a time where everything is connected. By joining the Qualcomm family, you too can bring the future forward faster.

SOC & Hard Macro Physical Design

• SOC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineer
• Design for Test (DFT)
• CPU Design

Must have educational background in one or more of the following areas:

• Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
• Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
• Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
• Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
• Excellent analytical and problem solving skills.
• Ability to collaborate and work in teams.
• Good verbal and written communication skill

Educational Background:

Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE