The Cleans, Wet Etch, Plate Equipment Engineering opportunity is in a high-volume semiconductor wafer manufacturing environment
The position requires ownership and responsibility for the equipment support in manufacturing of cleans, wet etch and plate equipment
The individual must have a thorough technical understanding of the cleans, wet etch and plate equipment
The individual must be able to interface and effectively communicate with equipment suppliers, maintenance, manufacturing and engineering organizations
Demonstrated ability to resolve difficult equipment problems
Experience in problem solving methods and statistical methods
Tool installation and qualification
Identifying and reducing sources of variation
Preventing and reducing wafer scrap
Ability to drive defect reduction
Improve tool reliability and availability
Improving equipment monitoring and control to reduce variation
Developing and writing specifications and standard work documentation
Strong verbal and written communication skills
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More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
LI-97b2
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